Abstract: the first embedded AI Summit in 2021 landed in Shanghai in March, and the first guests were announced.

With the progress of technology, more and more AI capabilities are migrating from the cloud to terminal devices, and embedded AI is on the rise. Because embedded devices have limited computing power and are extremely sensitive to power consumption and cost, the development and deployment of embedded AI applications still face challenges in the computing power and power consumption of the underlying hardware, and have attracted great attention in academia and industry. The research and development of algorithms, software and hardware is becoming more and more prosperous.

The research of micro machine learning (TinyML) with model compression as the core is becoming more and more active, and the development of open source software and tools represented by AI reasoning engine is also emerging one after another.Enzhipu、Italian semiconductorsVeteran MCU manufacturers are also iterating and laying out their software and hardware products around embedded AI.

On the afternoon of March 12, 2021, the "GTIC 2021 embedded AI Innovation Summit" sponsored by Zhiyi Technology, the first media in the intelligent industry, will be held at the 2021 China Home Appliances and Consumer Electronics Expo AWE at the Zhuomeiya Himalaya Hotel in Shanghai. This is also the first industry summit focusing on embedded AI at the beginning of 2021.

GTIC 2021 embedded AI Innovation Summit will focus on three sections: innovation of underlying hardware platform, open source of algorithms and software, and landing of embedded AI applications with the theme of "Intelligent World of everything". The software and hardware of AI? State innovation and application landing.

At that time, more than 10 decision-makers, entrepreneurs, researchers and technical experts from global semiconductor giants and AI chip companies, top AI algorithm companies, excellent AI open source software development teams, and AIoT platform enterprises will participate and bring keynote speeches to jointly feel the technological progress, industry trends and innovation opportunities of embedded AI.

At present, four guests have confirmed their participation in the meeting, namely, Wang Shaodi, CEO of Zicun Technology, Qin Jianfeng, Senior Manager of IoT Solutions of NXP Semiconductor, Huang Mingfei, co-founder and vice president of product research and development of OPEN AI LAB,Ruixin microQiu Jianbin, head of Toybrick AI development platform.

Wang Shaodi, founder and CEO of Zhicun Technology, has a bachelor's degree from Peking University and a PhD from the University of California, Los Angeles; the random deposit and calculation integrated computing design proposed in 2017 has received tens of millions of project funding. Published nearly 30 papers, applied for more than 50 patents at home and abroad, authorized 18; founded Zhi Cun Technology in October 2017, served as CEO. Zhixun Technology focuses on the design and development of artificial intelligence chips, releasing and mass-producing the world's first integrated deposit and accounting chip. It has accumulated nearly 300 million yuan of investment from industry and famous venture capital.

Qin Jianfeng, currently senior manager of IoT solutions for NXP Semiconductors, holds a master's degree from University of Science and Technology of China, responsible for the application development of AI / ML technology on NXP's MCU and MPU. He led a team to independently develop and release the world's first low-power, low-cost face recognition scheme based on MCU RT106F. The scheme based on binocular living algorithm is widely used in door locks and access control products. Leading the team to independently develop the Nano.AI tool chain can quickly and accurately deploy the customer's algorithm model from the MPU platform to the MCU platform to achieve the purpose of reducing power consumption and cost.

Before joining NXP, Qin Jianfeng includedIntel、BroadcomA number of international technology companies, including STM and Alcatel, hold technology R & D and management positions.

Huang Mingfei is currently the co-founder and vice president of product research and development of OPEN AI LAB, a master's degree in computer science from Xi'an University of Electronic Science and Technology, and a former director of processor application Asia-Pacific Research and Development at Broadcom Ltd Company in the United States. he has 18 years of core R & D and team management experience across embedded, communications and server processor product development and applications, neural network processor chips, software frameworks, application algorithms and systems experts in the field of artificial intelligence.

Qiu Jianbin, as the person in charge, built the Rockchip Toybrick AI open source hardware / software platform and founded the Toybrick community, allowing developers to quickly get started with AI application development, speed up the industry application research and development process, and improve the industry application ecology. As a senior engineer, he has participated in the software research and development of many flagship chip platforms of Ruixin Micro. In addition, lead the team to build all the Ruixin microchip TEE security system architecture and chip security related work.

Other guests are being confirmed one after another, and we will announce it as soon as possible.

The audience registration channel for the GTIC 2021 embedded AI Innovation Summit has been fully launched, and the summit will also start live video streaming at that time.

Registration: https://www.huodongxing.com/event/3581401666300