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英諾賽科:2024年度報告

INNOSCIENCE: ANNUAL REPORT 2024

HKEX ·  Apr 9 14:55

Summary by Moomoo AI

英諾賽科2024年營收達人民幣8.28億元,同比增長39.8%。隨著生產規模擴大及實施降本增效措施,毛損率由2023年的-61.1%大幅收窄至-19.5%,改善41.6個百分點。單位製造成本下降近40%,整體良率達95%。海外市場收入同比增長118.1%至1.26億元。公司持續深化在汽車電子、AI及數據中心等戰略新興領域的佈局。車規晶片交付數量同比增長986.7%;AI及數據中心晶片交付量同比增長669.8%;消費電子收入同比增長48.0%。年內推出50餘款新產品,客戶導入471項。推出3.0代高低壓工藝及車規╱合封器件平台,單位晶圓產出量較上一代提升30%以上。公司持續加大研發投入,研發費用佔營收38.99%。截至2024年底,累計專利授權達422項,技術已覆蓋全電壓譜系(15V-1,200V)。公司計劃將產能擴充至2萬片晶圓/月,並進一步拓展海外市場,聚焦重點客戶群,深化與境外傳統功率晶片大廠的戰略合作。
英諾賽科2024年營收達人民幣8.28億元,同比增長39.8%。隨著生產規模擴大及實施降本增效措施,毛損率由2023年的-61.1%大幅收窄至-19.5%,改善41.6個百分點。單位製造成本下降近40%,整體良率達95%。海外市場收入同比增長118.1%至1.26億元。公司持續深化在汽車電子、AI及數據中心等戰略新興領域的佈局。車規晶片交付數量同比增長986.7%;AI及數據中心晶片交付量同比增長669.8%;消費電子收入同比增長48.0%。年內推出50餘款新產品,客戶導入471項。推出3.0代高低壓工藝及車規╱合封器件平台,單位晶圓產出量較上一代提升30%以上。公司持續加大研發投入,研發費用佔營收38.99%。截至2024年底,累計專利授權達422項,技術已覆蓋全電壓譜系(15V-1,200V)。公司計劃將產能擴充至2萬片晶圓/月,並進一步拓展海外市場,聚焦重點客戶群,深化與境外傳統功率晶片大廠的戰略合作。
In 2024, Ingenico's revenue reached 0.828 billion yuan, a year-on-year increase of 39.8%. With the expansion of production scale and the implementation of cost reduction and efficiency enhancement measures, the gross loss rate narrowed significantly from -61.1% in 2023 to -19.5%, an improvement of 41.6 percentage points. The unit cost of goods manufactured decreased by nearly 40%, and the overall yield reached 95%. Revenue from the overseas market grew by 118.1% year-on-year to 0.126 billion yuan.The company continues to deepen its layout in strategic emerging fields such as Automotive Electronics, AI, and Datacenters. The number of automotive-grade chip deliveries increased by 986.7% year-on-year; AI and Datacenter chip deliveries increased by 669.8% year-on-year; revenue from Consumer Electronics increased by 48.0% year-on-year. Over...Show More
In 2024, Ingenico's revenue reached 0.828 billion yuan, a year-on-year increase of 39.8%. With the expansion of production scale and the implementation of cost reduction and efficiency enhancement measures, the gross loss rate narrowed significantly from -61.1% in 2023 to -19.5%, an improvement of 41.6 percentage points. The unit cost of goods manufactured decreased by nearly 40%, and the overall yield reached 95%. Revenue from the overseas market grew by 118.1% year-on-year to 0.126 billion yuan.The company continues to deepen its layout in strategic emerging fields such as Automotive Electronics, AI, and Datacenters. The number of automotive-grade chip deliveries increased by 986.7% year-on-year; AI and Datacenter chip deliveries increased by 669.8% year-on-year; revenue from Consumer Electronics increased by 48.0% year-on-year. Over 50 new products were launched during the year, with 471 customer integrations.The launch of the 3.0 generation high and low voltage processes and the automotive/combined packaging component platform improved the unit wafer output by over 30% compared to the previous generation.The company continues to increase its R&D investment, with R&D expenses accounting for 38.99% of revenue. By the end of 2024, a total of 422 patent grants have been achieved, with technology covering the entire voltage spectrum (15V-1,200V). The company plans to expand its production capacity to 0.02 million wafers per month and further expand into overseas markets, focusing on key customer groups and deepening strategic cooperation with traditional overseas power chip manufacturers.
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