Icheon, South Korea, May 2 (Reuters) - South Korea's SK Hynix 000660.ks Said on Thursday Its High-Bandwidth Memory (Hbm) Chips Used in AI Chipsets Are Almost Sold Out for 2025, After Their 2024 Chips Were Fully Booked.
Chief Executive Officer Kwak Noh-Jung Said the Nvidia Supplier and the World's Second-Largest Memory Chipmaker Will Begin Sending Samples of the Latest Version of Hbm Chips, Called 12-Layer Hbm3E, in May and Begin Mass Producing Them in the Third-Quarter.
Kwak Said Its Hbm Products This Year Had Already Sold Out, While 2025 Hbm Volumes Were Almost Sold Out Amid a Rapid Expansion of AI Technology Into a Wider Range of on-Device Applications Such as Smartphones, Pcs, and Automobiles.
(Reporting by Joyce Lee and Heekyong Yang
Editing by Ed Davies)